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Describe your image
Describe your image
Describe your image
Describe your image
Photomask
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography and the production of microfluidic patterns.
MiNAN's photomask is made by quartz glass and soda glasses with following spec:
1. Minimum line width 1.5um, resolution 0.2um
2. 4in~6in wafer photolithography
Our customer can provide CAD file and we provide Mask Design for approval. We provide 1~2 weeks time fabrication service.
Lithography
Lithography is one of most used technology in MEMS fabrication. Lithography can transfer patterns from photomask to photoresist via contact printing, proximity printing or project printing. Lithography usually includes wafer clean, spin coating, soft-bake, alignment, exposure, development, hard-bake, etching and measurement etc.
MiNAN provides various lithography service:
1. Electron beam lithography: minimum line width 8nm, precision +/-10nm
2. Contact printing: minimum line width 0.8um, multi-layer alignment with precision <0.5um, 2in to 8in wafer size.
SU8 master
SU8 is one of negative photoresist with good mechanical, dielectric, chemical resistant and thermal properties, and good biocompatibility. It can be used for fabrication of microfluidic chip for cell culture, molecular diagnostics etc.
SU8 is also widely used as a mould for PDMS soft lithography chip fabrication
MINAN provide SU master fabrication service:
1. SU8 Photolithogrpahy for fabrication master for PDMS casting on 2in~6in wafer
2. Multi-layer SU8
3. Minimum line width 0.8um, maximum thickness 150um.
We provide 1~2 weeks time fabrication service.
PDMS microfluidic chip
PDMS is widely used in prototyping microfluidics. It is chemical resistant and optically transparent.
MINAN provide PDMS microfluidic chip fabrication service
PDMS chip specification:
1. Minimum feature size: 5um
2. Minimum spacing between feature 20um
3. Minimum hight 10um
We provide 1~2 weeks time fabrication service.
Dry etching
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface. A common type of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.
MINAN provide DRIE etching service for microfluidic patterns.
Dry etching feature size:
1. Aspect rato: 20:1
2. Wafer size 2in~8in with uniformity better than +/-2%, wafer to wafer variation is better than +/-5%,
3. Process repeatability is better than
3. Minimum hight 10um +/-3%
We provide 2 weeks time fabrication service.
Film deposition
A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Deposition of films is important for semiconductor devices. They are also critical to make electrode for microfluidic chips.
MINAN provides various film deposition processes, including PECVD, PEPVD and electron beam evaporation. We can deposit various metal films Al, Au, Ag, Cr, Cu, Mo, Ni, Pt, Sn, Ti, AuGe
Specification:
1. Wafer size 2in~6in with uniformity better than +/-3%.
2. Substrate materials: Silicon, quartz, PET, PI etc.
3. Film thickness: 5nm~2000nm
We provide 2～3 weeks time fabrication service.