Film Deposition | MiNAN Technologies

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Film Deposition

A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. Deposition of films is important for semiconductor devices. They are also critical to make electrode for microfluidic chips.

MINAN provides various film deposition processes, including PECVD, PEPVD and electron beam evaporation. We can deposit various metal films Al, Au, Ag, Cr, Cu, Mo, Ni, Pt, Sn, Ti, AuGe. Specification:

1. Wafer size 2in~6in with uniformity better than +/-3%.

2. Substrate materials: Silicon, quartz, PET, PI etc.

3. Film thickness: 5nm~2000nm

Lead time: 2～3 weeks.