MINAN provides various film deposition processes, including PECVD, PEPVD and electron beam evaporation. We can deposit various metal films Al, Au, Ag, Cr, Cu, Mo, Ni, Pt, Sn, Ti, AuGe. Specification:
1. Wafer size 2in~6in with uniformity better than +/-3%.
2. Substrate materials: Silicon, quartz, PET, PI etc.
3. Film thickness: 5nm~2000nm
Lead time: 2～3 weeks.